A first pair of radiators and are provided on a first side of the bus structure 40 straddling the first side panel Similarly, a second pair of side radiators and are provided on the opposite side straddling the second side panel Radiators , , , and are mounted on each of the exposed sides of the four electronics bays From this radiator mounting configuration, radiators are provided which face in six distinct directions. To further insulate the bus structure 40, it is anticipated that the propellant tanks and be covered with the thermal blankets, as known in the art.
These blankets will prevent heat from the electronics bays from transferring into the propellant tanks and It is further anticipated that thermal blankets be provided on outer covers of the electronics bays These thermal blankets will prevent heat from reflected light to build up within the electronics bay This thermal approach isolates thermal loads into the six separate thermal management bays corresponding to the four electronics bays and the two auxiliary bays 94 and Each of the four electronics bays have a direct radiative view to space on two opposite sides of the spacecraft.
This permits a simplified design approach which does not require the transport of great quantities of heat across the body of the bus structure It is anticipated that the type equipment mounted into the two auxiliary bays 94 and 96 would remain generally constant from mission to mission, and sizing of a radiator for this equipment would remain standard. Since the equipment placed in the electronics bays could vary dramatically from mission to mission, the size of radiators , , , and would vary accordingly.
The bay comprises a generally rectangular cabinet having a front cover , as described above. The electronics bay can be equipped to hold a pair of electronics subassemblies The subassemblies install into the electronics bay and are clamped in place with wedge locking devices.
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Each of the subassemblies would have a plurality of slots , with each slot configured to receive a circuit card It is anticipated that each of the electronics bays have an internal back plane to which the subassemblies and their respective cards connect. It should be apparent that each electronics bay can be readily modified or adapted to receive a wide variety of circuit cards The circuit cards would typically control many of the housekeeping functions described above, such as communications, position calculation or power management.
It should be further appreciated by those skilled in the art that the circuit cards can be rapidly removed and replaced to change or alter functions, or to repair failed systems, without disturbing any other element of the spacecraft. An exemplary payload is provided which mounts readily onto the top panel An exemplary solar panel is mounted onto each of the side panels 68, with a first solar panel shown in a folded configuration and a second solar panel shown in a partially deployed configuration.
Additionally, an exemplary antenna has been mounted onto an exposed surface of one of the electronic bays Lastly, a launch vehicle adaptor is provided below the base plate As known in the art, the launch vehicle adaptor will enable the spacecraft bus structure 40 to be mounted above an expendable launch vehicle. Having thus described a preferred embodiment of a multi-mission spacecraft bus, it should now be apparent to those skilled in the art that the aforestated objects and advantages for the within system have been achieved.
It should also be appreciated by those skilled in the art that various modifications, adaptations, and alternative embodiments thereof may be made within the scope and spirit of the present invention. For example, while the spacecraft bus shown in FIG. The cell areas devoted to the propulsion tanks could be used for additional storage. These examples demonstrate the flexibility of the present invention, in that the basic vehicle can be rapidly reconfigured to fit any specific need.
Effective date : Year of fee payment : 4. Year of fee payment : 8. Year of fee payment : A multi-mission spacecraft bus structure is provided which has a plurality of internal thermally-isolated cells, and a plurality of external mounting surfaces The spacecraft bus structure comprises a plurality of half frame panels, which are secured to plurality of longerons.
The half-frame panels each have a pair of broad planar surfaces, a center abutting surface, a pair of end-abutting surfaces, and a pair of miter joint surfaces.
Adjacent half-frame panels can either join at the center abutting surfaces, or at the edge mounting surfaces The bus structure is further sealed at the top and at the bottom by mounting plates. External electrical equipment bays can be secured to a plurality of the external mounting surfaces.
Externally mounted radiators are provided to remove excess heat from the internal cells.
The radiators each face in directions distinct from each other. The present invention is further defined by the following claims. We claim: 1. A multi-mission spacecraft bus which adapts a payload to a launch vehicle, comprising: a space frame structure enclosing a plurality of internal cells and having a plurality of external mounting surfaces, said structure further comprising a plurality of longerons, and a plurality of half frame panels mating to said longerons, said half frame panels enclosing said cells;.
The multi-mission spacecraft bus of claim 1, wherein a first and a second one of said half-frame panels are joined at said end abutting surfaces, a third and a fourth of said half frame panels are joined at said end abutting surfaces, and said second and said third of said half-frame panels are joined at said center mounting surfaces. The multi-mission spacecraft bus of claim 2, wherein: said longerons have edge mount surfaces which secure to said miter joint surfaces, and carry primary structural load of said space frame structure.
The multi-mission spacecraft bus of claim 3, further comprising: a first and a second side panel, each of said side panels joining an adjacent pair of said longerons and enclosing one of said internal cells. The multi-mission spacecraft bus of claim 4, further comprising: a plurality of externally mounted electronics bays, each of said bays securing to an exposed external surface of said space frame structure. The multi-mission spacecraft bus of claim 5, wherein: said electronics bays contain a plurality of internal slots, each of said slots capable of receiving a circuit card, each of said electronics bays further having a front cover which secures to enclose said circuit cards within said electronics bay.
The multi-mission spacecraft bus of claim 6, wherein: said electronics bays are accessible only from external to said spacecraft bus. The multi-mission spacecraft bus of claim 7, further comprising: a plurality of externally mounted radiators, each of said radiators being thermally connected to individual ones of said internal cells to remove heat from said cells. The multi-mission spacecraft bus of claim 8, wherein each of said radiators face in a distinct direction relative each other.
A multi-mission spacecraft bus structure, comprising: a plurality of longerons and a plurality of half frame panels mated to said longerons, said structure providing a plurality of internal cells and having a plurality of external mounting surfaces, wherein said half frame panels each comprise a center abutting surface, broad planar surfaces extending from said center abutting surface, end abutting surfaces extending from said broad planar surfaces, and miter joint surfaces extending from said end abutting surfaces.
The multi-mission spacecraft bus structure of claim 10, wherein: adjacent ones of said half frame panels can be joined together either at said center abutting surfaces or at said end abutting surfaces. The multi-mission spacecraft bus structure of claim 11, wherein: said longerons secure to said miter joint surfaces, and carry primary structural load of said spacecraft bus structure. The multi-mission spacecraft bus structure of claim 12, further comprising: a side panel joining an adjacent pair of said longerons and forming one of said cells in cooperation with said half frame panels.
USA en. Modular, independent subsystem design satellite bus and variable communication payload configurations and missions. Method for adjusting stiffness and acoustic properties of an externally mountable spacecraft equipment module. USB1 en. EAB1 en. USB2 en. DEB4 en. Soft ride method for changing the altitude or position of a spacecraft in orbit. Industrial control system with means for releasably securing a plurality of electronic modules. Modular segment adapted to provide a passively cooled housing for heat generating electronic modules.
Modular, independent subsystem design satellite for standard bus and variable communication payload configuration and missions.
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see Canalias et al. Assessment of mission design including utilization of libration points and weak stability boundaries. FRA1 en. Atmospheric Flight Mechanics Conference Jan Write a Review Add Your Review. Entry Fees Check Official Website. Participants The estimated count of participants is calculated by multiplying the normalized participant interest generated on platform with a regional multiplier.
Organizers can update the count here upto Delegates Estimated Count. Baymont by Wyndham San Diego Do.. Oct 07 Oct 27 Our main activity is the development of carbon fibre composite structures including large spacecraft primary structures. These provide the fundament on which new products are based on. Our software engineering also offers custom software development for special applications in the mechanical and thermal domains.
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